在传统存储产品方面，10nm以下DRAM制造工艺正成为主流，并逐步向7nm工艺突破，通过“FinFET架构+TSV技术”提升密度、降低功耗。3D NAND堆叠层数突破400层后，“垂直堆叠”难度加剧，厂商转向“水平扩展+架构优化”，比如三星V-NAND的阶梯式架构、Kioxia的BiCS架构，同时引入“HKC（高K介质+金属栅）”技术，解决高层数堆叠的漏电、散热问题，制造工艺从“层数竞赛”转向“架构+工艺”双重竞争。
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happenstance at IBM. Besides its mainframes and their peripherals, IBM in the